| 9892997 |
Adaptable molded leadframe package and related method |
Katsumi Okawa |
2018-02-13 |
| 9530774 |
Semiconductor package for III-nitride transistor stacked with diode |
Jason Zhang, Alberto Guerra |
2016-12-27 |
| 9312245 |
III-nitride device and FET in a package |
Jason Zhang, Alberto Guerra |
2016-04-12 |
| 8963338 |
III-nitride transistor stacked with diode in a package |
Jason Zhang, Alberto Guerra |
2015-02-24 |
| 8847408 |
III-nitride transistor stacked with FET in a package |
Jason Zhang, Alberto Guerra |
2014-09-30 |
| 7149088 |
Half-bridge power module with insert molded heatsinks |
Bertrand Vaysse, Fabio Necco |
2006-12-12 |
| 7042730 |
Non-isolated heatsink(s) for power modules |
Bertrand Vaysse, Thanh Tran, Ajit Dubhashi |
2006-05-09 |
| 6362964 |
Flexible power assembly |
Ajit Dubhashi, Stephen Siu, Bertrand Vaysse, Michael Corfield |
2002-03-26 |
