Patents per Year
Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date | Approx Value ⓘ |
|---|---|---|---|---|
| 9892997 | Adaptable molded leadframe package and related method | Katsumi Okawa | 2018-02-13 | |
| 9530774 | Semiconductor package for III-nitride transistor stacked with diode | Jason Zhang, Alberto Guerra | 2016-12-27 | |
| 9312245 | III-nitride device and FET in a package | Jason Zhang, Alberto Guerra | 2016-04-12 | |
| 8963338 | III-nitride transistor stacked with diode in a package | Jason Zhang, Alberto Guerra | 2015-02-24 | |
| 8847408 | III-nitride transistor stacked with FET in a package | Jason Zhang, Alberto Guerra | 2014-09-30 | $35,758,000 |
| 7149088 | Half-bridge power module with insert molded heatsinks | Bertrand Vaysse, Fabio Necco | 2006-12-12 | $10,750,000 |
| 7042730 | Non-isolated heatsink(s) for power modules | Bertrand Vaysse, Thanh Tran, Ajit Dubhashi | 2006-05-09 | $16,048,000 |
| 6362964 | Flexible power assembly | Ajit Dubhashi, Stephen Siu, Bertrand Vaysse, Michael Corfield | 2002-03-26 | $43,241,000 |