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Home › Signal via positioning in a multi-layer circuit board using a genetic via placement solver

Signal via positioning in a multi-layer circuit board using a genetic via placement solver

US Patent 9875331 · Granted Jan 23, 2018

Estimated economic value: $4,886,000 ⓘ

Assignee

IBM

Inventors

Sungjun Chun (39 patents)
Matteo Cocchini (49 patents)
Michael A. Cracraft (37 patents)

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