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Home › Process for making semiconductor dies, chips and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of AACNT-TS via opens

Process for making semiconductor dies, chips and wafers using non-contact measurements obtained from DOEs of NCEM-enabled fill cells on test wafers that include multiple means/steps for enabling NC detection of AACNT-TS via opens

US Patent 9870966 · Granted Jan 16, 2018

Estimated economic value: $1,134,000 ⓘ

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