Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems

Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems

US Patent 9869713 · Granted Jan 16, 2018

Estimated economic value: $20,859,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Hybrid optical fiber, endoscopic system, and method for examining a sample2025
Absorption medium and method for removing carbon dioxide from combustion exhaust2025
SETBP1 inhibitors for the treatment of myeloid neoplasms and solid tumors2024
High electron mobility transistor2024
Semiconductor structure and method of fabricating the same2024
Capacitor seat plate assembly2023
Magnetic particle imaging (MPI) reconstruction method based on RecNet model2023
Wireless earphone noise reduction method and device, wireless earphone, and stor2023
Fluorescence moleculartomography reconstruction method based on prior guidance o2023
Ultra-low power neuromorphic artificial intelligence computing accelerator2023
Ultra-low power neuromorphic artificial intelligence computing accelerator2023
Method for calculating internal explosion load speed based on incremental crack 2023