Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

Conductive through-polymer vias for capacitative structures integrated with packaged semiconductor chips

US Patent 9852979 · Granted Dec 26, 2017

Estimated economic value: $16,353,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated circuit package for isolation dies2025
Multi-chip module leadless package2024
Method for improving transistor performance2024
Methods, apparatus, and systems to facilitate multi-channel isolation2023
Multi-chip module leadless package2022
Packaged multichip module with conductive connectors2022
Thermistor die-based thermal probe2022
3D-printed protective shell structures with support columns for stress sensitive2021
Methods, apparatus, and systems to facilitate multi-channel isolation2021
Bond wire support systems and methods2021
Packaged semiconductor system having unidirectional connections to discrete comp2020
Packaged semiconductor system having unidirectional connections to discrete comp2020