Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Fabrication method of embedded chip substrate

Fabrication method of embedded chip substrate

US Patent 9768103 · Granted Sep 19, 2017

Estimated economic value: $1,598,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Detection system and detection method for composite detector2025
Packaged component with composite pin structure and manufacturing method thereof2025
Semiconductor package structures and methods of manufacturing the same2023
Optical communication package structure and method for manufacturing the same2023
Optical communication package structure and method for manufacturing the same2022
Glitch mitigation in selectable output current mirrors with degeneration resisto2021
Power and ground design for through-silicon via structure2020
Semiconductor package structure and method of manufacturing the same2019
Through silicon vias for semiconductor devices and manufacturing method thereof2017
Semiconductor die, semiconductor wafer and method for manufacturing the same2017
Fabrication method of embedded chip substrate2016
Fabrication method of embedded chip substrate2016