Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Integrated circuit package and method of making the same

Integrated circuit package and method of making the same

US Patent 9735138 · Granted Aug 15, 2017

Assignee

No assignee recorded.

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Process for fabricating circuit components in matrix batches2022
Process for packaging circuit component having copper circuits with solid electr2020
Process for packaging circuit component having copper circuits with solid electr2019
High performance package and process for making2016
Discrete circuit component having fabrication stage clogged through-holes and pr2006
Discrete circuit component having an up-right circuit die with lateral electrica2005
Metal bonding method for semiconductor circuit components employing prescribed f2004