Issued Patents All Time
Showing 1–8 of 8 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 11521862 | Process for fabricating circuit components in matrix batches | Che-kai Hu | 2022-12-06 |
| 10600703 | Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof | — | 2020-03-24 |
| 10256116 | Process for packaging circuit component having copper circuits with solid electrical and thermal conductivities and circuit component thereof | — | 2019-04-09 |
| 9735138 | Integrated circuit package and method of making the same | — | 2017-08-15 |
| 9515047 | High performance package and process for making | — | 2016-12-06 |
| 6989559 | Discrete circuit component having fabrication stage clogged through-holes and process of making the same | Wen-Long Chen, Cheng-Chieh Yang | 2006-01-24 |
| 6870261 | Discrete circuit component having an up-right circuit die with lateral electrical connections | Wen-Long Chen, Pan-Nan Chen, Ming Liang, Cheen-Hai Yu | 2005-03-22 |
| 6818541 | Metal bonding method for semiconductor circuit components employing prescribed feeds of metal balls | Cheng-Chieh Yang, Wen-Long Chen, Yao-Huang Tsai, Pan-Nan Chen | 2004-11-16 |