Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach

High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach

US Patent 9728439 · Granted Aug 8, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Reactive hot melt adhesive having high initial strength, good heat stability and2020
High-temperature spin-on temporary bonding compositions2012
Spin-on protective coatings for wet-etch processing of microelectronic substrate2012
Metal-clad laminates having improved peel strength and compositions useful for t2012
High-temperature spin-on temporary bonding compositions2011
Spin-on protective coatings for wet-etch processing of microelectronic substrate2010
Thermally decomposable spin-on bonding compositions for temporary wafer bonding2010
Negative photoresist for silicon KOH etch without silicon nitride2010
Wet developable hard mask in conjunction with thin photoresist for micro photoli2008
Spin-on protective coatings for wet-etch processing of microelectronic substrate2008
Amine compounds and curable compositions derived therefrom2006
Amine compounds and curable compositions derived therefrom2003