Issued Patents All Time
Showing 1–5 of 5 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10787596 | Reactive hot melt adhesive having high initial strength, good heat stability and low monomeric diisocyanate | Thomas F. Kauffman | 2020-09-29 |
| 9728439 | High-temperature, spin-on, bonding compositions for temporary wafer bonding using sliding approach | Chenghong Li | 2017-08-08 |
| 8236669 | High-temperature spin-on temporary bonding compositions | Wenbin Hong | 2012-08-07 |
| 7935780 | High-temperature spin-on temporary bonding compositions | Wenbin Hong | 2011-05-03 |
| 7713835 | Thermally decomposable spin-on bonding compositions for temporary wafer bonding | — | 2010-05-11 |