Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaged device including cavity package with elastic layer within molding compound

Packaged device including cavity package with elastic layer within molding compound

US Patent 9680445 · Granted Jun 13, 2017

Estimated economic value: $34,590,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polymer lid wafer-level package with an electrically and thermally conductive pi2020
Bulk acoustic wave resonator2019
Acoustic resonator including extended cavity2019
Method for housing an electronic component in a device package and an electronic2016
Electrical device with protruding contact elements and overhang regions over a c2014
Semiconductor device layer structure and method of fabrication2013
Method for housing an electronic component in a device package and an electronic2013
Electrical device with protruding contact elements and overhang regions over a c2012
Method for manufacturing a coupled resonator device2012
Device and method for reducing a voltage dependent capacitive coupling2012
Method for developing a photoresist2012
Apparatus comprising a device and method for producing it2010