Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method for housing an electronic component in a device package and an electronic component housed in the device package

Method for housing an electronic component in a device package and an electronic component housed in the device package

US Patent 9312212 · Granted Apr 12, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polymer lid wafer-level package with an electrically and thermally conductive pi2020
Bulk acoustic wave resonator2019
Systems and methods for providing electromagnetic interference (EMI) shielding b2019
Frame elements for package structures comprising printed circuit boards (PCBs)2018
Packaged device including cavity package with elastic layer within molding compo2017
Electrical device with protruding contact elements and overhang regions over a c2014
Electrical device with protruding contact elements and overhang regions over a c2014
Electronic device and method of manufacturing same2014
Semiconductor device layer structure and method of fabrication2013
Semiconductor device layer structure and method of fabrication2013
Method for housing an electronic component in a device package and an electronic2013
Method for housing an electronic component in a device package and an electronic2013