Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Package-on-package type package including integrated circuit devices and associated passive components on different levels

Package-on-package type package including integrated circuit devices and associated passive components on different levels

US Patent 9679853 · Granted Jun 13, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Memory system including a sub-controller and operating method of the sub-control2025
Storage device based on daisy chain topology2024
Memory system including a sub-controller and operating method of the sub-control2024
Wafer cassette stocker and wafer cassette drying method using the same2023
Semiconductor package and method of manufacturing the semiconductor package2021
Semiconductor memory package2019
Semiconductor package and method of manufacturing the semiconductor package2019
Package-on-package type package including integrated circuit devices and associa2018
Package board having internal terminal interconnection and semiconductor package2018
Integrated circuit card socket having a terminal with a loop-shaped portion2016
Semiconductor package2016
Semiconductor device including coupling conductive pattern2015