Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor package and system with an isolation structure to reduce electromagnetic coupling

Semiconductor package and system with an isolation structure to reduce electromagnetic coupling

US Patent 9673164 · Granted Jun 6, 2017

Estimated economic value: $8,247,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Group III nitride-based radio frequency transistor amplifiers having source, gat2024
Device packages with uniform components and methods of forming the same2024
Group III nitride-based radio frequency transistor amplifiers having source, gat2024
Group III nitride-based radio frequency amplifiers having back side source, gate2023
Integrated multiple-path power amplifier2022
Integrally-formed multiple-path power amplifier with on-die combining node struc2022
Digital step attenuator and method for operating a digital step attenuator2022
Power amplifier integrated circuit with integrated shunt-l circuit at amplifier 2022
Power amplifier with integrated bias circuit having multi-point input2021
Multiple-stage power amplifiers and amplifier arrays configured to operate using2021
Doherty amplifier circuit with integrated harmonic termination2021
Multiple-path RF amplifiers with angularly offset signal path directions, and me2021