Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods

Semiconductor backmetal (BM) and over pad metallization (OPM) structures and related methods

US Patent 9640497 · Granted May 2, 2017

Estimated economic value: $9,634,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor package electrical contact structures and related methods2025
Multi-chip system-in-package2025
Lighting apparatus2025
Semiconductor package electrical contacts and related methods2025
Semiconductor package electrical contacts and related methods2025
Substrate structures and methods of manufacture2025
Die sidewall coatings and related methods2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Low stress asymmetric dual side module2025
Substrate alignment systems and related methods2025