Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stacked microelectronic devices

Stacked microelectronic devices

US Patent 9640458 · Granted May 2, 2017

Estimated economic value: $18,118,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor device assemblies with balanced wires, and associated methods2025
Wire bonding for stacked memory dies2025
Flexible interposer for semiconductor dies2025
Three dimensional semiconductor trace length matching and associated systems and2025
Three dimensional semiconductor trace length matching and associated systems and2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Surface mount device bonded to an inner layer of a multi-layer substrate2025
Split via structure for semiconductor device packaging2025
Apparatus including direct-contact heat paths and methods of manufacturing the s2025
Apparatus including direct-contact heat paths and methods of manufacturing the s2025
Cross stack bridge bonding devices and associated methods2025
Cross stack bridge bonding devices and associated methods2025