Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and systems for releasably attaching support members to microfeature workpieces

Methods and systems for releasably attaching support members to microfeature workpieces

US Patent 9595504 · Granted Mar 14, 2017

Estimated economic value: $20,925,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Semiconductor devices with redistribution structures configured for switchable r2025
Semiconductor device assembly with die support structures2024
Semiconductor devices with redistribution structures configured for switchable r2023
Methods of manufacturing stacked semiconductor die assemblies with high efficien2023
Apparatuses and methods for internal heat spreading for packaged semiconductor d2022
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2022
Semiconductor devices with redistribution structures configured for switchable r2021
Semiconductor device assembly with die support structures2021
Stacked semiconductor die assemblies with improved thermal performance and assoc2019
Stacked semiconductor die assemblies with high efficiency thermal paths and mold2019
Methods of manufacturing stacked semiconductor die assemblies with high efficien2018
Apparatuses and methods for heat transfer from packaged semiconductor die2018