Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › System for directly measuring the depth of a high aspect ratio etched feature on a wafer

System for directly measuring the depth of a high aspect ratio etched feature on a wafer

US Patent 9587932 · Granted Mar 7, 2017

Estimated economic value: $3,303,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Assessing alignment of top and bottom ends of TSVs and characterizing microfabri2018
Assessing alignment of top and bottom ends of TSVs and characterizing microfabri2018
Wafer shape thickness and trench measurement2017
Wafer shape thickness and trench measurement2017
Methods and systems for use in grind shape control adaptation2016
System for directly measuring the depth of a high aspect ratio etched feature on2014
System for directly measuring the depth of a high aspect ratio etched feature on2014
Bilateral arm trainer and method of use2010
Wafer measurement system and apparatus2010
Wafer measurement system and apparatus2010
Trench measurement system employing a chromatic confocal height sensor and a mic2009
Trench measurement system employing a chromatic confocal height sensor and a mic2009