Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Pluggable LGA socket for high density interconnects

Pluggable LGA socket for high density interconnects

US Patent 9577361 · Granted Feb 21, 2017

Estimated economic value: $2,827,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Electronic package structure with offset stacked chips and top and bottom side c2024
Mitigating cooldown peeling stress during chip package assembly2023
Integrated circuit structure with optical absorber layer over optical grating co2022
Multi-layered substrates of semiconductor devices2022
Microelectronics package with ultra-low-K dielectric region between stacked ante2022
Lid/heat spreader having targeted flexibility2022
Laminated stiffener to control the warpage of electronic chip carriers2022
High-bandwidth embedded optical connector with latching mechanism2022
Photonics package with face-to-face bonding2021
Integrated circuit structure with optical absorber layer over optical grating co2021
Pluggable LGA socket for high density interconnects2021
Pluggable LGA socket for high density interconnects2021