Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Stress buffer layer for integrated microelectromechanical systems (MEMS)

Stress buffer layer for integrated microelectromechanical systems (MEMS)

US Patent 9550670 · Granted Jan 24, 2017

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

U-LED, U-LED device, display and method for the same2025
Industrial electrical connector having a data diode module2025
μ-LED, μ-LED device, display for augmented reality or lighting applications2025
Method for producing lignocellulose materials in the presence of caprolactam and2025
Prosthesis liner2025
Electronic devices with adjustable received sample bit width2025
Camera, A-pillar arrangement, and vehicle2025
Modulation of SPTLC1 via recombinant adeno-associated vectors2025
Method for fabricating a semiconductor device package comprising a pin in the fo2025
Semiconductor apparatuses with radio-frequency line elements, and associated man2025
Slicing machine with cross transfer device for loading outside the machine and l2025
Microhomology mediated repair of microduplication gene mutations2025