Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Lead frame having a perimeter recess within periphery of component terminal

Lead frame having a perimeter recess within periphery of component terminal

US Patent 9536852 · Granted Jan 3, 2017

Estimated economic value: $11,622,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatuses and methods for encapsulated devices2021
Apparatuses and methods for encapsulated devices2021
Method of fabricating a circuit module2020
System and methods for substrates2020
Apparatuses and methods for encapsulated devices2019
Apparatuses and methods for encapsulated devices2019
Systems and methods for lead frame locking design features2019
Systems and methods for substrates2019
Systems and methods for lead frame locking design features2017
Circuit module such as a high-density lead frame array (HDA) power module, and m2017
Solder flow-impeding plug on a lead frame2017
Solder flow-impeding plug on a lead frame2017