Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Flip-chip light emitting diode package module and manufacturing method thereof

Flip-chip light emitting diode package module and manufacturing method thereof

US Patent 9490404 · Granted Nov 8, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Off-axis light emitting device and image capturing module using the same2025
Package structure2025
Light sensing module and electronic device using the same2024
Optoelectronic package having second encapsulant cover first encapsulant and pho2024
Light sensing module and electronic device using the same2023
Package structure2022
Lead frame array for carrying chips and LED package structure with multiple chip2021
Package structure and manufacturing method thereof2021
LED package structure2020
Manufacturing method of LED package structure2020
Optical sensor module and a wearable device including the same2020
LED package structure2020