Optoelectronic package having second encapsulant cover first encapsulant and photonic devices

Assignee

• Lite-On Opto Technology (Changzhou) Co.
• Lite-On Technology

Inventors

• Chien-Hsiu Huang (7 patents)
• BO-JHIH CHEN (7 patents)
• KUO-MING CHIU (27 patents)
• Meng-Sung Chou (26 patents)
• Wei-Te Cheng (18 patents)
• Kai-Chieh Liang (14 patents)
• Yun-Ta Chen (11 patents)
• Yu Wang (87 patents)

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