Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Materials, structures and methods for microelectronic packaging

Materials, structures and methods for microelectronic packaging

US Patent 9484277 · Granted Nov 1, 2016

Estimated economic value: $14,338,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Apparatus with a substrate provided with plasma treatment2022
Semiconductor device having polyimide layer2019
Polymer grafting for enhanced dielectric and interconnect material adhesion2015
Materials, structures and methods for microelectronic packaging2014
Aligned nanotube bearing composite material2013
Aligned nanotube bearing composite material2012
Materials, structures and methods for microelectronic packaging2012
Die-attach films for chip-scale packaging, packages made therewith, and methods 2010
System, apparatus, and method for advanced solder bumping2010
Aligned nanotube bearing composite material2009
System, apparatus, and method for advanced solder bumping2009
Materials, structures and methods for microelectronic packaging2008