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Home › Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

Epoxy resin composition for optical semiconductor device, and lead frame for optical semiconductor device, encapsulation type optical semiconductor element unit and optical semiconductor device each obtainable by using the epoxy resin composition

US Patent 9450158 · Granted Sep 20, 2016

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