Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packaging and cooling method and apparatus for power semiconductor devices

Packaging and cooling method and apparatus for power semiconductor devices

US Patent 9443786 · Granted Sep 13, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Polyphase AC to DC converter2025
Fluid cooled magnetic element2024
Rotor assembly and method for motor end winding cooling and bearing lubrication2024
Polyphase switching regulator2023
Liquid cooled magnetic element2022
Fluid cooled magnetic element2022
Wound strip machine2022
Compact thermally efficient traction motor inverter2021
Compact thermally efficient traction motor inverter2021
Heat dissipation apparatus and method for power semiconductor devices2021
Heat dissipation apparatus and method for power semiconductor devices2021
Electric machine stator with liquid cooled teeth2020