Issued Patents All Time
Showing 1–2 of 2 patents
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 10892208 | Heat dissipation apparatus and method for power semiconductor devices | Hung-Li Chang, Lon Cooper | 2021-01-12 |
| 9443786 | Packaging and cooling method and apparatus for power semiconductor devices | Wally E. Rippel, Paul F. Carosa, George R. Woody, Lon Cooper | 2016-09-13 |