Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Method of replacing an existing contact of a wafer probing assembly

Method of replacing an existing contact of a wafer probing assembly

US Patent 9429638 · Granted Aug 30, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of electrically contacting a bond pad of a device under test with a probe2019
Resilient electrical interposers, systems that include the interposers, and meth2018
Quantum mechanical measurement device2017
Optical magnetometers2017
Systems and methods for testing electronic devices that include low power output2016
High frequency interconnect structures, electronic assemblies that utilize high 2016
Resilient electrical interposers, systems that include the interposers, and meth2015
Resilient electrical interposers, systems that include the interposers, and meth2015
Membrane probing method using improved contact2013
Replaceable coupon for a probing apparatus2013
Membrane probing structure with laterally scrubbing contacts2011
Probing apparatus with impedance optimized interface2011