Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods and systems for bonding multiple wafers

Methods and systems for bonding multiple wafers

US Patent 9399596 · Granted Jul 26, 2016

Estimated economic value: $23,166,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Laser-sustained plasma light source with tapered window2025
High current contact device2024
Swirler for laser-sustained plasma light source with reverse vortex flow2024
Systems and methods for contact immersion lithography2024
Systems and methods for contact immersion lithography2022
Systems and methods for verifying photomask cleanliness2022
Apparatus for bonding wafers and an optically-transparent thin film made from th2021
Apparatus for bonding wafers and an optically-transparent thin film made from th2021
Systems and methods for lithography2021
Balloon launching apparatuses2020
Apparatus for bonding wafers and an optically-transparent thin film made from th2020
Apparatus for bonding wafers and an optically-transparent thin film made from th2020