Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes

Methods, materials and apparatus for improving control and efficiency of layer-by-layer processes

US Patent 9387505 · Granted Jul 12, 2016

Estimated economic value: $8,662,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Embedded cooling systems for advanced device packaging and methods of manufactur2025
Electronic device cooling structures bonded to semiconductor elements2025
Direct bonded stack structures for increased reliability and improved yield in m2025
Embedded cooling systems and methods of manufacturing embedded cooling systems2025
Direct gang bonding methods including directly bonding first element to second e2024
Direct bonded stack structures for increased reliability and improved yield in m2024
Laminated optical products and methods of making them2023
Anti-icing surface with polymeric supports2022
Devices and methods for installation tools for use with splice kits2022
Direct bonded stack structures for increased reliability and improved yield in m2022
Selective light-blocking optical products having a neutral reflection2020
Selective light-blocking optical products having a neutral reflection2020