Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material

Semiconductor device and method of mounting cover to semiconductor die and interposer with adhesive material

US Patent 9378983 · Granted Jun 28, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method for controlling boat/strip type solder ball placement system2025
Automatically executing application routines with user inputs2025
Display device comprising a substrate having a first subpixel and a second subpi2025
Intelligent power generation module2024
Intelligent power generation module2024
Electronic device for operating a cellular communication and method for the same2024
Display device having an oxide insulating film between subpixels and method for 2024
Electronic device and method for processing call request in electronic device2024
Display device, and method for manufacturing the same2024
Inter-cell interference mitigation method in dynamic time division duplex enviro2023
Method of accessing network based on access technology and electronic device the2023
Correlated double sampling circuit and image sensor including the same2022