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Home › Non-destructive, wafer scale method to evaluate defect density in heterogeneous epitaxial layers

Non-destructive, wafer scale method to evaluate defect density in heterogeneous epitaxial layers

US Patent 9368415 · Granted Jun 14, 2016

Estimated economic value: $6,457,000 ⓘ

Assignee

IBM

Inventors

Stephen W. Bedell (347 patents)
John A. Ott (77 patents)

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