{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices", "item": "https://www.patentleaderboard.com/patent/9345135"}]}
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Home › Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

Electronic devices including two or more substrates electrically connected together and methods of forming such electronic devices

US Patent 9345135 · Granted May 17, 2016

Estimated economic value: $4,120,000 ⓘ

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