Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Printed circuit board package structure and manufacturing method thereof

Printed circuit board package structure and manufacturing method thereof

US Patent 9258888 · Granted Feb 9, 2016

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Imaging lens assembly module, camera module and electronic device2025
Camera module and electronic device2025
Light-folding element for camera module, camera module and electronic device2025
Imaging lens assembly, camera module and electronic device2025
Imaging lens assembly module, camera module and electronic device2024
Imaging lens element assembly and imaging lens assembly module2024
Imaging lens system, image capturing unit and electronic device2024
Imaging lens assembly module, camera module and electronic device2024
Imaging lens assembly, image capturing device and electronic device2024
Annular optical element, imaging lens module and electronic device2024
Computer-implemented methods for evidencing the existence of a digital document,2024
Lens assembly, optical unit and electronic device2024