Issued Patents All Time
| Patent # | Title | Co-Inventors | Date |
|---|---|---|---|
| 9743523 | Printed circuit board package structure and manufacturing method thereof | Bo-Shiung Huang, Wei-Hsiung Yang, Cheng-Feng Lin | 2017-08-22 |
| 9258888 | Printed circuit board package structure and manufacturing method thereof | Bo-Shiung Huang, Wei-Hsiung Yang, Cheng-Feng Lin | 2016-02-09 |
| 9101072 | Method of embedding magnetic component in substrate | Bo-Shiung Huang, Tzu-Yuan Fan, Wei-Hsiung Yang, Kai Chen | 2015-08-04 |