Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig

Jig, manufacturing method thereof, and flip chip bonding method for chips of ultrasound probe using jig

US Patent 9136139 · Granted Sep 15, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Fitness device mounted in vehicle seat2025
Semiconductor device including multiple sources and image sensor including the s2025
Device for cooling a motor2025
Severe fever with thrombocytopenia syndrome virus2025
Multi-focusing device for each ultrasonic depth including micro-machined ultraso2025
Air purifier2025
Nanoparticles for sensing phosphate, method for manufacturing the same, and memb2025
Fibrinogen biological material detection sensor including an erythrocyte membran2025
Vehicle wheel having adjustable insert neck and method for manufacturing the sam2025
Electric vehicle drive apparatus2025
Substrate treating apparatus and substrate support unit2025
Ultrasound diagnosis apparatus and method of operating the same2025