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Home › Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same

Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same

US Patent 9123552 · Granted Sep 1, 2015

Estimated economic value: $10,392,000 ⓘ

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