Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Controlled fluid delivery in a microelectronic package

Controlled fluid delivery in a microelectronic package

US Patent 9101931 · Granted Aug 11, 2015

Estimated economic value: $13,627,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Integrated heat spreader with enhanced vapor chamber for multichip packages2024
Thermal management solutions for integrated circuit packages2023
Microelectronic package having electromagnetic interference shielding2021
Package structure to enhance yield of TMI interconnections2018
Flexible electronic assembly method2017
Thermoset polymides for microelectronic applications2017
Package structure to enhance yield of TMI interconnections2017
Controlled fluid delivery in a microelectronic package2017
Controlled fluid delivery in a microelectronic package2017
Controlled fluid delivery in a microelectronic package2017
Meltprocessed fluoropolymer article and method for melt-processing fluoropolymer2015
Thermoset polyimides for microelectronic applications2014