Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP

Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POP

US Patent 9087701 · Granted Jul 21, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Current sensor for power electronic converter2025
Printed circuit board (PCB) cooling2025
Immersion cooling electronic devices2025
Pin-fin cooling for printed circuit boards (PCBs)2025
Mini-channel cold plate with three-dimensional adaptive flow-path using bi-metal2025
Hybrid power supply systems, methods, and devices for excimer lamps2024
Excimer lamp electrode geometry2024
Thermally enhanced FCBGA package2024
Smart power router and protection for medium voltage DC distribution2024
Electrocaloric heat transfer system and method of operating the same2024
Hybrid power supply systems, methods, and devices for excimer lamps2024
Pulse switch-based power supply systems, methods, and devices2024