Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Electronic component having encapsulated wiring board and method for manufacturing the same

Electronic component having encapsulated wiring board and method for manufacturing the same

US Patent 9059187 · Granted Jun 16, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Zoom lens and imaging apparatus2025
Wiring substrate2025
Coil component and manufacturing method therefor2025
Wiring substrate and method for manufacturing wiring substrate2025
Wiring substrate2025
Zoom lens and imaging apparatus2025
Vehicle controller and method for controlling vehicle2025
Hall sensor using face down structure with through substrate vias2025
Wafer chip scale packaging with ball attach before repassivation2025
Wiring substrate2024
Wiring substrate2024
Wafer chip scale package2024