{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Scalable interconnect modules with flexible channel bonding", "item": "https://www.patentleaderboard.com/patent/9042404"}]}
Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Scalable interconnect modules with flexible channel bonding

Scalable interconnect modules with flexible channel bonding

US Patent 9042404 · Granted May 26, 2015

Estimated economic value: $23,933,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Sensor band for multimodal sensing of biometric data2025
I/O adaptor module for use with a building controller2025
Seemingly monolithic interface between separate integrated circuit die2025
Distributed multi-die protocol application interface2024
Interface bridge between integrated circuit die2024
Multichip package with protocol-configurable data paths2024
Display screen with graphical user interface for a building controller2024
Building controller with adaptable mount2023
Electrical connector for a controller2023
Interface bridge between integrated circuit die2023
Multichip package with protocol-configurable data paths2023
Distributed multi-die protocol application interface2023