Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Daisy chain connection for testing continuity in a semiconductor die

Daisy chain connection for testing continuity in a semiconductor die

US Patent 9024315 · Granted May 5, 2015

Estimated economic value: $9,129,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Multi-tier IC package including processor and high bandwidth memory2024
Chipset and manufacturing method thereof2024
Contactless fuel payment systems and methods2024
Complementary ring oscillators to monitor in-situ stress within integrated circu2023
Merged power pad for improving integrated circuit power delivery2023
IC die to IC die interconnect using error correcting code and data path interlea2023
Monitoring system of cable laying state2022
Merged power pad for improving integrated circuit power delivery2022
Wrapped signal shielding in a wafer fanout package2021
Electrical circuit comprising a trim circuit2021
Bottom package with metal post interconnections2021
Hybrid passive-on-glass (POG) acoustic filter2021