Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device

Microstructure device comprising a face to face electromagnetic near field coupling between stacked device portions and method of forming the device

US Patent 9018730 · Granted Apr 28, 2015

Estimated economic value: $921,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Dynamic adaptive biasing for amplification circuitry2025
Highly coupled inductor design for reducing area and power consumption of a mult2025
Attenuator using variable resistors2025
Piecewise linear function generating electronic circuit, corresponding generator2025
Phase-reconfigurable circuits with programmable power splitting for dual-input p2025
Signal amplification circuitry2025
Frequency multiplier circuitry, corresponding system and vehicle2025
Oscillator circuit, corresponding radar sensor, vehicle and method of operation2025
Envelope detector circuit, corresponding receiver circuit and galvanic isolator 2024
Envelope detector circuit, corresponding receiver circuit and galvanic isolator 2024
Envelope detector circuit, corresponding receiver circuit and galvanic isolator 2024
Digital self-calibration for automatic offset cancellation2024