Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Packages and methods for packaging MEMS microphone devices

Packages and methods for packaging MEMS microphone devices

US Patent 9002040 · Granted Apr 7, 2015

Estimated economic value: $3,952,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Curable silicone compositions2022
Microphone system with a stop member2016
Microphone system with offset apertures2016
Packages and methods for packaging2015
Air-release features in cavity packages2014
Packaged integrated device die between an external and internal housing2014
Packages and methods for packaging using a lid having multiple conductive layers2014
Packages and methods for packaging MEMS microphone devices2013
Packages and methods for packaging MEMS microphone devices2013
Plurality of semiconductor die in an assembly2007
Encapsulated sensor device2006
Stacked semiconductor die2006