Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Semiconductor wafer with reduced thickness variation and method for fabricating same

Semiconductor wafer with reduced thickness variation and method for fabricating same

US Patent 8987898 · Granted Mar 24, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Method of manufacture for a cascode semiconductor device2025
Systems and a method for maintenance of HVAC systems2023
Cascode semiconductor2022
Cascode semiconductor device and method of manufacture2022
Solderable contact and passivation for semiconductor dies2017
Method for forming a reliable solderable contact2017
Power semiconductor device with a double metal contact and related method2017
Power semiconductor device with a double metal contact and related method2017
Method for fabricating a shallow and narrow trench FET and related structures2017
Surface mountable power components2016
Power semiconductor device with a double metal contact2016
Power semiconductor device with a double metal contact2016