Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Three dimensional interconnect structure and method thereof

Three dimensional interconnect structure and method thereof

US Patent 8975753 · Granted Mar 10, 2015

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Modules with integrated circuits and devices2025
Color-agnostic pixel repair sites2025
Displays with distributed pixel interpolation2025
Displays with interpolated pixels2025
Multi-level micro-device tethers2025
Rigid micro-modules with iLED and light conductor2025
Redundant pixel layouts2025
Pixel group and column token display architectures2025
Displays with current-controlled pixel clusters2025
Printed structure with electrical contact having reflowable polymer core2024
Micro-transfer printing stamps and components2024
Micro assembled LED displays and lighting elements2024