Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › QFN package and manufacturing process thereof

QFN package and manufacturing process thereof

US Patent 8962395 · Granted Feb 24, 2015

Estimated economic value: $4,573,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Thermally enhanced electronic package2016
Conductive structure and method for forming the same2015
Method of manufacturing semiconductor packaging2015
Conductive structure and method for forming the same2014
Structure of stacking chips and method for manufacturing the same2014
Semiconductor structure having no adjacent bumps between two adjacent pads2014
Packaging structure2014
Computer implemented apparatus for generating and filtering creative proposal2014
Thermally enhanced electronic package2013
Packaging method involving rearrangement of dice2013
Solder cap bump in semiconductor package and method of manufacturing the same2013
Packaging method involving rearrangement of dice2013