{"@context": "https://schema.org", "@type": "BreadcrumbList", "itemListElement": [{"@type": "ListItem", "position": 1, "name": "Home", "item": "https://www.patentleaderboard.com/"}, {"@type": "ListItem", "position": 2, "name": "Method for compensating for wafer shape measurement variation due to variation of environment temperature", "item": "https://www.patentleaderboard.com/patent/8949057"}]}
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Home › Method for compensating for wafer shape measurement variation due to variation of environment temperature

Method for compensating for wafer shape measurement variation due to variation of environment temperature

US Patent 8949057 · Granted Feb 3, 2015

Estimated economic value: $11,706,000 ⓘ

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