Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Extended liner for localized thick copper interconnect

Extended liner for localized thick copper interconnect

US Patent 8946896 · Granted Feb 3, 2015

Estimated economic value: $4,826,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Oil level measuring device2025
LDMOS fin-type field-effect transistors including a dummy gate2020
Fin-type transistors with spacers on the gates2020
Fin formation for semiconductor device2020
SOI device structures with doped regions providing charge sinking2020
Scaled memory structures or other logic devices with middle of the line cuts2019
Memory array with buried bitlines below vertical field effect transistors of mem2019
Multiple gate length device with self-aligned top junction2019
Methods of forming source/drain contact structures on integrated circuit product2019
LDMOS finFET structures with shallow trench isolation inside the fin2019
Two-port vertical SRAM circuit structure and method for producing the same2019
Asymmetric spacer for preventing epitaxial merge between adjacent devices of a s2018