Patent Leaderboard
USPTO Patent Rankings Data through Dec 31, 2025
Home › Multiple layer printed circuit board with unplated vias

Multiple layer printed circuit board with unplated vias

US Patent 8889999 · Granted Nov 18, 2014

Estimated economic value: $17,584,000 ⓘ

Assignee

Inventors

View full patent text on Google Patents →

More Patents by These Inventors

Circuit board with non-plated hole interposed between plated holes to prevent fo2020
Structuring and circuitizing printed circuit board through-holes2011
Package configuration and manufacturing method enabling the addition of decoupli2010
Semiconductor package having discrete non-active electrical components incorpora2010
Package configuration and manufacturing method enabling the addition of decoupli2009
Ball assignment system2008
Substrate via layout to improve bias humidity testing reliability2006
Functionality based package design for integrated circuit blocks2006
Resistive materials2006
Measurement of package interconnect impedance using tester and supporting tester2005
Substrate impedance measurement2005
Direct positive image photo-resist transfer of substrate design2005